ABLESTIK JM7000具有高可靠性，低空洞特點，耐高溫可達370度。

常用超大規模集成電路封裝，陶瓷焊接封裝和焊接密封封裝

LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.

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