Interflux? IF 2005M is a low solids no-clean flux, designed to evaporate during the soldering process. This means also the safest no-clean flux for high-tech circuits. With no rosin or resin to create a sticky residue, there is nothing left after wave...
Interflux PacIFic 2009MLF has been developed to minimize micro solder ball formation. It is an adapted version of the interflux PacIFic 2009M. Conventional VOC-free fluxes may give more solder balling than alcohol based fluxes on micro ball sensitive so...
Interflux? IF 2005C is a low solids no-clean flux, especially developed for selective soldering in lead-free and SnPb applications. It is the version of the IF 2005- series with the largest process window in activity. Interflux IF 2005C is also suit...